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Electroplating Scilicent

Electroplating Wafer Holders - Scilicent

Professional electroplating wafer holders with dry contact system for safe substrate handling. Available in multiple sizes and materials. Delivered and supporte

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Electroplating Wafer Holders - Scilicent

Advanced Wafer Holding Technology

Silicet’s Electroplating Wafer Holders provide a comprehensive solution for safe substrate handling during electroplating processes. These innovative holders feature a dry contact system that ensures secure holding and sealing with 3 mm edge exclusion, delivering full scope contacting without electrolyte contact.

Superior Design Features

The holders are engineered for simple substrate replacement in seconds, accommodating wafer thickness tolerances of ±100µ. For applications requiring higher tolerances, compensation is achieved by using a foil. The robust construction ensures reliable performance across various electroplating applications.

Flexible Material Options

Standard materials include PP or PEEK, with Teflon and other materials available on request. Flexholders for different wafer thicknesses are possible, providing maximum versatility for diverse application requirements.

Comprehensive Size Range

Available in standard sizes including 1, 2, 3, 4, 5, 6, 8 & 12 inch configurations. Other sizes and forms are available to meet specific customer requirements. Optional electrode installation to the holder provides additional functionality when needed.

Technical Specifications
  • Contact SystemDry contact system
  • Edge Exclusion3 mm
  • Wafer Thickness Tolerance±100µ
  • Standard MaterialsPP or PEEK
  • Alternative MaterialsTeflon and others (on request)
  • Standard Sizes1, 2, 3, 4, 5, 6, 8 & 12 inch
  • Substrate ReplacementSimple replacement in seconds
  • Special FeaturesFlexholder for different wafer thickness

Frequently Asked Questions

What makes the dry contact system special?
The dry contact system provides safe holding and sealing with 3 mm edge exclusion, ensuring full scope contacting without electrolyte contact. This design eliminates contamination risks and ensures reliable electroplating processes.
What wafer sizes are supported?
Standard holders are available for 1, 2, 3, 4, 5, 6, 8 & 12 inch wafers. Other sizes and forms are available upon request to meet specific customer requirements.
How quickly can substrates be replaced?
The holders are designed for simple substrate replacement in seconds, making them highly efficient for production environments where quick changeovers are essential.
What materials are the holders made from?
Standard materials include PP or PEEK, with Teflon and other specialized materials available on request. This flexibility allows for optimization based on specific process requirements and chemical compatibility needs.
Can the holders accommodate different wafer thicknesses?
Yes, the holders accommodate wafer thickness tolerances of ±100µ. For higher tolerances, compensation can be achieved using a foil. Flexholders for different wafer thicknesses are also available.
Are spare parts available?
All components used in the wafer holders are available as spare parts. This ensures long-term support and cost-effective maintenance of your electroplating equipment.

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